The Diamond Technologies, Inc. DEC MP2-OSM computing module brings together efficient edge AI, multimedia capability, and advanced connectivity in a compact form factor. Built using the STMicroelectronics STM32MP2 processor, it delivers high performance and dependable operation for intelligent embedded applications. From industrial systems to connected devices, the DEC MP2-OSM computing module helps simplify development time and bring innovative embedded devices to market faster.
Powered by dual Arm® Cortex®-A35 and Cortex®-M33 processors, the DEC MP2-OSM computing module combines efficient processing with real-time responsiveness. Its Neural Processing Unit (NPU) enables fast, low-power AI and machine learning at the edge. With support for LPDDR4 memory, eMMC storage, and high-speed interfaces such as Ethernet, PCIe, USB, and CAN-FD, the DEC MP2-OSM computing module is equipped to manage complex embedded computing tasks, while maintaining reliable performance and low power consumption.
The DEC MP2-OSM computing module is designed for a wide range of embedded and connected applications. Its efficient processing, AI capability, and reliable communication features make it suitable for intelligent control systems, data-driven equipment, and smart devices operating at the edge. Whether enabling automation, monitoring, or interactive functions, the DEC MP2-OSM computing module delivers high performance, consistent operation, and long-term dependability that customers can trust.
Key Features:
- Up to two Arm® Cortex®-A35 (1.5 GHz)
- 32-bit Arm® Cortex®-M33 (400 Mhz) real-time processor
- Arm® Ethos™ U-65 (microNPU) for AI/ML
- Flexible memory and storage: LPDDR4/DDR4, eMMC, external flash
Processor Options
- ST Microelectronics STM32MP2 processor with 1 or 2 Arm® Cortex®-A35 cores running up to 1.5 GHz
- Arm® Cortex®-M33 core running up to 400 MHz
- A3D GPU VeriSilicon® – up to 900 MHz
- Optional NPU
Embedded Memory
- Up to 4GB of 32-bit wide LPDDR4
- eMMC 5.1, configurable
Network Connectivity
- Wi-Fi 6 (802.11ax) 1×1 Dual-Band
- Bluetooth/BLE 5.4
- CC3351 with single u.FL antenna
- 3X Gigabit Ethernet RGMII Interfaces
USB
- 1 USB 2.0
- 1 USB 2.0/3.0
Display
- MIPI DSI (4-lane, up to 2.5Gbs/lane) 1536p @ 60fps
- LVDS 2 (4-lane) 1536p @ 60fps
Camera
- MIPI CSI-2(2-lane, 2.5Gbs/lane) 5Mp @30fps
Audio
- 4 synchronous audio interfaces (SAI)
- S/PDIF inputs
Serial I/O
- Up to 9 UART interfaces
- Up to 8 I2C interfaces
- Up to 8 SPI interfaces
- Up to 4 I3C interfaces
- Up to 3 CAN FD interfaces
GPIO
- Up to 64 multiplexed GPIOs supporting various peripherals such as PWMs, SDIO, UART, SPI, and I2C
RTC
- On-board ultra-low power real-time clock (RTC)
Debug
- JTAG support
Mechanical
- OSM-L Form Factor
- Dimensions: 45mm x 45mm
- Weight: 11 g
Compliance
- RoHS Compliant
- Reach Compliant
Seamless Development with Expert Support
Gain full access to technical documentation, expert support, and premium engineering services for your Diamond Technologies Computing Modules. Our sister company, Beacon EmbeddedWorks provides a robust Technical Support website where you can find comprehensive resources, including software, documentation, and a technical forum.
Visit: diamondt.com/modulesupport to get started.
Comprehensive Support Tailored To Your Needs
For customers with an annual usage of 1,000+ units, premium services are available for a fee, including BOM management, dedicated project support, inventory services, enhanced reporting, and advanced troubleshooting.
To get a quote, call 978-461-1140 or email: info@diamondt.com
The comprehensive DEC MP2-OSM Development Kit includes everything you need to jumpstart your product development:
- Diamond Technologies, Inc. DEC MP2-OSM embedded computing module
- Audio & Network Jacks
- Cables
- All necessary Software & BSP’s